Model : LBTek
Model :
Spatial Multi‑Focus
The LBTEK Spatial Multi-Focus Chamfer Cutting Head is mainly composed of a polarization modulation module, spatial multi‑focus DOE and focusing lens module (typically high‑magnification objective lens). It is designed for chamfer cutting in stealth dicing of transparent materials, greatly improving cutting‑process efficiency and reducing production costs. By adjusting system parameters, users can flexibly modify focal‑point spacing and spatial‑distribution patterns to satisfy diverse cutting requirements.
| Item | Specification | Item | Specification |
|---|---|---|---|
| Design Wavelength | 1064 nm | Number of Focal Points | ＜60 pcs |
| Beam Quality (M²) Requirement | ≤1.3 | Focal‑point Pitch (Axial / Lateral) | Customizable |
| DOE Clear Aperture | 10 mm | Tolerance of Focal‑point Pitch | ＜3 μm |
| DOE Outer Diameter | Ø25.4×3.2 mm | Axial Processing Thickness | ＜1 mm |
| Required Input Beam Polarization for DOE | Circular polarization | Lateral Processing Width | ＜170 μm |
| Refractive Index of Medium | 1.54 | Focal‑point Power‑density Uniformity (RMS) | ＞90% |
| Input Spot Size (1/e²) | Ø8 mm | Total Diffraction Efficiency (e²) | ＞90% |
- Highly integrated
- Low aberration
- Special focal‑point distribution pattern
- Flexible customization
