The LBTEK Bessel Processing Head is an optical module for the terminal of laser processing systems. It consists of refractive and diffractive optical elements assembled inside a metal mechanical barrel. By means of light‑field modulation from an axicon lens and beam shaping of the double‑telecentric optical system, it generates Bessel beams that meet laser‑processing requirements.
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Model
|
Design Wavelength/nm
|
Input Aperture/mm
|
Air Focal Depth/mm
|
Spot Size/μm
|
|
BPH‑1064‑6‑05
|
1064
|
Ø6
|
0.5
|
Ø0.74
|
|
BPH‑1064‑6‑1
|
1064
|
Ø6
|
1.0
|
Ø1.28
|
|
BPH‑1064‑6‑2
|
1064
|
Ø6
|
2.0
|
Ø1.2
|
|
BPH‑1064‑8‑4
|
1064
|
Ø8
|
4.0
|
Ø1.47
|
|
BPH‑1064‑10‑6
|
1064
|
Ø10
|
6.0
|
Ø1.54
|
|
BPH‑1064‑10‑8
|
1064
|
Ø10
|
8.0
|
Ø1.67
|
|
RBPH‑1064‑8‑1
|
1064
|
Ø8
|
1.0
|
Ø1.3
|
|
RBPH‑1064‑10‑2
|
1064
|
Ø10
|
1.0
|
Ø1.5
|
|
RBPH‑1064‑10‑3
|
1064
|
Ø10
|
1.0
|
Ø2.5
|
|
RBPH‑1064‑10‑6
|
1064
|
Ø10
|
1.0
|
Ø3
|
|
RBPH‑1064‑10‑8
|
1064
|
Ø10
|
1.0
|
Ø3.5
|
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Adopts high‑transmittance optical substrates for high overall transmittance
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Unique optical design with low aberration, spot size <2 μm
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Cutting depth ranges from 0.2‑12 mm, suitable for materials of various thicknesses
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Compact module with great compatibility for easy integration
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Minor chipping on cutting edges, zero taper and small heat‑affected zone